Invention Grant
- Patent Title: Low height connector and method of producing the same
- Patent Title (中): 低高度连接器及其制造方法
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Application No.: US13552782Application Date: 2012-07-19
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Publication No.: US08740655B2Publication Date: 2014-06-03
- Inventor: Hajime Kato , Masayuki Kataoka , Hiroki Komatsu , Takeshi Innan
- Applicant: Hajime Kato , Masayuki Kataoka , Hiroki Komatsu , Takeshi Innan
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-159124 20110720
- Main IPC: H01R4/18
- IPC: H01R4/18
Abstract:
A method of producing a low height connector, includes: removing an insulating covering from a first part of an electric wire; forming the electric wire into a predetermined shape in which the first part of the electric wire is bent; joining a terminal to a second part of the electric wire; and molding the electric wire to surround at least the first part and the second part of the electric wire with a housing to obtain the low height connector.
Public/Granted literature
- US20130023158A1 LOW HEIGHT CONNECTOR AND METHOD OF PRODUCING THE SAME Public/Granted day:2013-01-24
Information query
