Invention Grant
- Patent Title: Polishing method and polishing apparatus
- Patent Title (中): 抛光方法和抛光装置
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Application No.: US13415143Application Date: 2012-03-08
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Publication No.: US08740667B2Publication Date: 2014-06-03
- Inventor: Masako Kodera , Yukiteru Matsui
- Applicant: Masako Kodera , Yukiteru Matsui
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2011-244581 20111108
- Main IPC: B24B37/015
- IPC: B24B37/015
Abstract:
According to one embodiment, a polishing method comprises pressing a substrate being rotated against a polishing pad being rotated and supplying slurry on the polishing pad, measuring a surface temperature of the polishing pad, and when the surface temperature is not less than a predetermined temperature, jetting jet stream containing supercooled droplets from a nozzle having a narrow portion toward the polishing pad.
Public/Granted literature
- US20130115855A1 POLISHING METHOD AND POLISHING APPARATUS Public/Granted day:2013-05-09
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