Invention Grant
- Patent Title: CMP retaining ring with soft retaining ring insert
- Patent Title (中): CMP固定环带软固定环插入
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Application No.: US13252897Application Date: 2011-10-04
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Publication No.: US08740673B2Publication Date: 2014-06-03
- Inventor: William J. Kalenian , Larry Spiegel
- Applicant: William J. Kalenian , Larry Spiegel
- Applicant Address: US CA San Luis Obispo
- Assignee: Strasbaugh
- Current Assignee: Strasbaugh
- Current Assignee Address: US CA San Luis Obispo
- Agency: Crockett & Crockett, PC
- Agent K. David Crockett, Esq.
- Main IPC: B24B7/04
- IPC: B24B7/04
Abstract:
A wafer carrier adapted to further reduce the edge effect and allow a wafer to be uniformly polished across its entire surface, with a retaining ring made from very hard materials such as PEEK, PET or polycarbonate with a hardness in the range of 80 to 85 Shore D, while the inner surface or insert is made of polyurethane or other material with a hardness in the range of 85 to 95 Shore A.
Public/Granted literature
- US20120088366A1 CMP Retaining Ring with Soft Retaining Ring Insert Public/Granted day:2012-04-12
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