Invention Grant
- Patent Title: Guidewire
- Patent Title (中): 导丝
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Application No.: US13461465Application Date: 2012-05-01
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Publication No.: US08740814B2Publication Date: 2014-06-03
- Inventor: Tadahiro Koike
- Applicant: Tadahiro Koike
- Applicant Address: JP Nagoya-shi
- Assignee: Asahi Intecc Co., Ltd.
- Current Assignee: Asahi Intecc Co., Ltd.
- Current Assignee Address: JP Nagoya-shi
- Agency: Oliff PLC
- Priority: JP2011-146508 20110630
- Main IPC: A61B5/00
- IPC: A61B5/00

Abstract:
A guidewire includes a core shaft, a coil body that covers the core shaft, and a joining portion formed of metal solder that couples the core shaft and the coil body. The coil body includes a tungsten wire and a noble metal plating layer that covers at least a portion of a surface of the tungsten wire. A surface of the noble metal plating layer has a first uneven shape, including at least one recess and at least one protrusion.
Public/Granted literature
- US20130006221A1 GUIDEWIRE Public/Granted day:2013-01-03
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