Invention Grant
- Patent Title: Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
- Patent Title (中): 化学机械抛光和化学机械抛光方法的水分散体
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Application No.: US12867954Application Date: 2008-12-18
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Publication No.: US08741008B2Publication Date: 2014-06-03
- Inventor: Masayuki Motonari , Eiichirou Kunitani , Tomikazu Ueno , Takahiro Iijima , Takashi Matsuda
- Applicant: Masayuki Motonari , Eiichirou Kunitani , Tomikazu Ueno , Takahiro Iijima , Takashi Matsuda
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-035507 20080218; JP2008-145787 20080603
- International Application: PCT/JP2008/073082 WO 20081218
- International Announcement: WO2009/104334 WO 20090827
- Main IPC: C09K3/14
- IPC: C09K3/14
Abstract:
A chemical mechanical polishing aqueous dispersion includes (A) a graft polymer that includes an anionic functional group in a trunk polymer, and (B) abrasive grains.
Public/Granted literature
- US20110059680A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD Public/Granted day:2011-03-10
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