Invention Grant
- Patent Title: Heat treatment method and heat treatment apparatus
- Patent Title (中): 热处理方法和热处理装置
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Application No.: US13533206Application Date: 2012-06-26
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Publication No.: US08741064B2Publication Date: 2014-06-03
- Inventor: Hisashi Inoue , Shunichi Matsumoto , Yasushi Takeuchi
- Applicant: Hisashi Inoue , Shunichi Matsumoto , Yasushi Takeuchi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell LLP.
- Priority: JP2007-249039 20070926; JP2007-249040 20070926
- Main IPC: C23C16/00
- IPC: C23C16/00

Abstract:
A substrate holder has two holder constituting bodies, each having a plurality of columns arranged on an imaginary circle, and substrate holding sections that hold circumferential portions of respective substrates. The holder constituting bodies hold the substrates so that either their front surfaces or their back surfaces face upward with a substrate having an upward facing front and a substrate having an upward facing rear being alternately arranged in a vertical direction. At least one of the holder constituting bodies moves in the vertical direction to change the positions of the holder constituting bodies relative to each other. A distance between a first pair of vertically adjacent substrates with their respective front surfaces facing each other is set to ensure treatment uniformity, and to be larger than a distance between a second pair of vertically adjacent substrates with their respective back surfaces facing each other.
Public/Granted literature
- US20120329291A1 HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS Public/Granted day:2012-12-27
Information query
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