Invention Grant
- Patent Title: Method of making a resilient floor tile
- Patent Title (中): 制造弹性地砖的方法
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Application No.: US12854942Application Date: 2010-08-12
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Publication No.: US08741085B2Publication Date: 2014-06-03
- Inventor: Kean M. Anspach , Thomas C. Bair , John R. Eshbach, Jr.
- Applicant: Kean M. Anspach , Thomas C. Bair , John R. Eshbach, Jr.
- Applicant Address: US DE Wilmington
- Assignee: AWI Licensing Company
- Current Assignee: AWI Licensing Company
- Current Assignee Address: US DE Wilmington
- Agent Michael U. Lee
- Main IPC: B32B38/04
- IPC: B32B38/04

Abstract:
A resilient floor tile includes a base layer, a film layer, a decorative film layer, and a topcoat. The resilient floor tile has a shaped edge formed on an upper surface thereof that extends about at least a portion of a perimeter of the resilient floor tile. In order to make the resilient floor tile, a continuous sheet of a base layer is conveyed into a press die. The press die is actuated from an open position to a closed position. The continuous sheet is cut with a blade of a cutting tool of the press die to form side surfaces of the resilient floor tile when the press die is in the closed position. A shaped edge is formed on at least a portion of a perimeter of an upper surface of the resilient floor tile with a forming tool of the press die when the press die is in the closed position.
Public/Granted literature
- US20110041989A1 Resilient floor tile and method of making the same Public/Granted day:2011-02-24
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