Invention Grant
- Patent Title: Handling layer and adhesive parts formed therewith
- Patent Title (中): 处理层和由其形成的粘合部分
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Application No.: US13353748Application Date: 2012-01-19
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Publication No.: US08741094B2Publication Date: 2014-06-03
- Inventor: David Sheasley , Christopher Hable , Keith Madaus
- Applicant: David Sheasley , Christopher Hable , Keith Madaus
- Applicant Address: US MI Romeo
- Assignee: Zephyros, Inc.
- Current Assignee: Zephyros, Inc.
- Current Assignee Address: US MI Romeo
- Agency: The Dobrusin Law Firm, PC
- Main IPC: B60J10/00
- IPC: B60J10/00 ; B29C65/00 ; B32B37/00 ; C08J5/00 ; C04B37/00

Abstract:
A handling layer and adhesive parts having the handling layer are formed according to the present invention along with used therefore.
Public/Granted literature
- US20120111488A1 HANDLING LAYER AND ADHESIVE PARTS FORMED THEREWITH Public/Granted day:2012-05-10
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