Invention Grant
- Patent Title: Sputtering apparatus, method of operating the same, and method of manufacturing substrate using the same
- Patent Title (中): 溅射装置及其操作方法以及使用其的制造基板的方法
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Application No.: US13238500Application Date: 2011-09-21
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Publication No.: US08741116B2Publication Date: 2014-06-03
- Inventor: Tae Hyun Lim , Hwan Kyu Yoo , Byung Han Yun
- Applicant: Tae Hyun Lim , Hwan Kyu Yoo , Byung Han Yun
- Applicant Address: KR Seoul KR Daegu-si KR Seoul
- Assignee: LG Display Co., Ltd.,AVACO Co., Ltd.,LG Electronics Inc.
- Current Assignee: LG Display Co., Ltd.,AVACO Co., Ltd.,LG Electronics Inc.
- Current Assignee Address: KR Seoul KR Daegu-si KR Seoul
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2006-0045490 20060522
- Main IPC: C23C14/34
- IPC: C23C14/34
Abstract:
A sputtering apparatus includes a susceptor for receiving a substrate, and a first target device disposed to be opposite to a center region of a substrate and at least second and third target devices disposed to be opposite to peripheral regions of the substrate, wherein the second and third target devices are rotatable.
Public/Granted literature
- US20120006266A1 SPUTTERING APPARATUS, METHOD OF OPERATING THE SAME, AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME Public/Granted day:2012-01-12
Information query
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