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US08741175B2 Desiccant composition for moisture-sensitive electronic devices 有权
湿度敏感电子设备的干燥剂组合物

Desiccant composition for moisture-sensitive electronic devices
Abstract:
A desiccant composition containing a polymeric binder and a dispersion of powders of desiccant materials is described. The desiccant composition has desiccant powders that are dispersed at least in part in form of micro-aggregates of desiccant particles surrounded by a polymeric encapsulating material having a different composition with respect to the polymeric binder.
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