Invention Grant
US08741204B2 Device and method for hot embossing of a polymer layer 有权
聚合物层的热压花的装置和方法

Device and method for hot embossing of a polymer layer
Abstract:
The invention relates to a device for hot embossing of a magnetic nanoparticle (N)-containing polymer layer and a method for hot embossing of a magnetic nanoparticle-containing polymer layer.
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