Invention Grant
US08741380B2 Fine metal structure, process for producing the same, fine metal mold and device
失效
精细金属结构,制造方法,精细金属模具及装置
- Patent Title: Fine metal structure, process for producing the same, fine metal mold and device
- Patent Title (中): 精细金属结构,制造方法,精细金属模具及装置
-
Application No.: US12859802Application Date: 2010-08-20
-
Publication No.: US08741380B2Publication Date: 2014-06-03
- Inventor: Hiroshi Yoshida , Haruo Akahoshi , Akihiro Miyauchi , Masahiko Ogino
- Applicant: Hiroshi Yoshida , Haruo Akahoshi , Akihiro Miyauchi , Masahiko Ogino
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2003-431801 20031226
- Main IPC: A61M5/00
- IPC: A61M5/00 ; A61M5/32

Abstract:
A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.
Public/Granted literature
- US20100310773A1 Fine Metal Structure, Process for Producing the Same, Fine Metal Mold and Device Public/Granted day:2010-12-09
Information query
IPC分类: