Invention Grant
- Patent Title: Metallic surface enhancement
- Patent Title (中): 金属表面增强
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Application No.: US12596559Application Date: 2008-04-18
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Publication No.: US08741390B2Publication Date: 2014-06-03
- Inventor: Joseph A. Abys , Shenliang Sun , Chonglun Fan , Edward J. Kudrak, Jr. , Cai Wang
- Applicant: Joseph A. Abys , Shenliang Sun , Chonglun Fan , Edward J. Kudrak, Jr. , Cai Wang
- Applicant Address: US CT West Haven
- Assignee: Enthone Inc.
- Current Assignee: Enthone Inc.
- Current Assignee Address: US CT West Haven
- Agency: Senniger Powers LLP
- International Application: PCT/US2008/060801 WO 20080418
- International Announcement: WO2008/131206 WO 20081030
- Main IPC: C23F11/167
- IPC: C23F11/167 ; C23F11/14 ; C23F11/16

Abstract:
A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.
Public/Granted literature
- US20100151263A1 METALLIC SURFACE ENHANCEMENT Public/Granted day:2010-06-17
Information query
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