Invention Grant
- Patent Title: Insulated wire
- Patent Title (中): 绝缘电线
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Application No.: US12829528Application Date: 2010-07-02
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Publication No.: US08741441B2Publication Date: 2014-06-03
- Inventor: Yuki Honda , Tomiya Abe , Hideyuki Kikuchi , Daisuke Hino
- Applicant: Yuki Honda , Tomiya Abe , Hideyuki Kikuchi , Daisuke Hino
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2009-272515 20091130
- Main IPC: B32B15/08
- IPC: B32B15/08 ; C08L79/08 ; H01B17/60

Abstract:
An insulated wire includes a conductor, and an insulating covering layer formed on a periphery of the conductor and including two or more insulating coatings. The insulating coatings include a polyamide-imide resin insulating material represented by chemical formula 1: where R indicates a divalent aromatic diamine including three or more aromatic rings. The insulating coatings are formed by applying and baking the polyamide-imide resin insulating material, and the polyamide-imide resin insulating material is obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing dicarboxylic acid being obtained by dehydration reaction of a diamine comprising a divalent aromatic diamine including three or more aromatic rings with an acid using an azeotropic solvent.
Public/Granted literature
- US20110127067A1 INSULATED WIRE Public/Granted day:2011-06-02
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