Invention Grant
US08741539B2 Hardmask composition, method of forming a pattern using the same, and semiconductor integrated circuit device including the pattern
有权
硬掩模组成，使用其形成图案的方法，以及包括图案的半导体集成电路器件
- Patent Title: Hardmask composition, method of forming a pattern using the same, and semiconductor integrated circuit device including the pattern
- Patent Title (中): 硬掩模组成，使用其形成图案的方法，以及包括图案的半导体集成电路器件
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Application No.: US13241332Application Date: 2011-09-23
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Publication No.: US08741539B2Publication Date: 2014-06-03
- Inventor: Seung-Bae Oh , Hwan-Sung Cheon , Sung-Wook Cho , Min-Soo Kim , Jee-Yun Song , Yoo-Jeong Choi
- Applicant: Seung-Bae Oh , Hwan-Sung Cheon , Sung-Wook Cho , Min-Soo Kim , Jee-Yun Song , Yoo-Jeong Choi
- Applicant Address: KR Gumi-Si, Kyeongsangbuk-Do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gumi-Si, Kyeongsangbuk-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2010-0129982 20101217
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; G03F7/11 ; G03F7/40
Abstract:
A hard mask composition, a method of forming a pattern, and a semiconductor integrated circuit device, the hard mask composition including a solvent; and a compound, the compound including a structural unit represented by the following Chemical Formula 1:
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