Invention Grant
- Patent Title: Method of manufacturing semiconductor module
- Patent Title (中): 制造半导体模块的方法
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Application No.: US13350966Application Date: 2012-01-16
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Publication No.: US08741665B2Publication Date: 2014-06-03
- Inventor: Sangyoung Kim , Jaereyun Jung , Sanggug Lee , Jongtae Park
- Applicant: Sangyoung Kim , Jaereyun Jung , Sanggug Lee , Jongtae Park
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2011-0009984 20110201
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
A method of manufacturing a semiconductor module is provided. The method includes forming semiconductor chips on a bare substrate, performing a burn-in process on the bare substrate including the semiconductor chips, sorting semiconductor chips that exceed a predetermined level of operability determined by testing electrical driving in the semiconductor chips on the burned-in bare substrate, separating the semiconductor chips from one another by cutting the bare substrate, and directly mounting the module semiconductor chips on a module substrate.
Public/Granted literature
- US20120196386A1 METHOD OF MANUFACTURING SEMICONDUCTOR MODULE Public/Granted day:2012-08-02
Information query
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