Invention Grant
- Patent Title: Co-integration of photonic devices on a silicon photonics platform
- Patent Title (中): 光子器件在硅光子平台上的协整
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Application No.: US13466766Application Date: 2012-05-08
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Publication No.: US08741684B2Publication Date: 2014-06-03
- Inventor: Wim Bogaerts , Joris Van Campenhout , Peter Verheyen , Philippe Absil
- Applicant: Wim Bogaerts , Joris Van Campenhout , Peter Verheyen , Philippe Absil
- Applicant Address: BE Leuven BE Ghent
- Assignee: IMEC,Universiteit Gent
- Current Assignee: IMEC,Universiteit Gent
- Current Assignee Address: BE Leuven BE Ghent
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/0352 ; H01L31/12

Abstract:
Disclosed are methods for co-integration of active and passive photonic devices on a planarized silicon-based photonics substrate. In one aspect, a method is disclosed that includes providing a planarized silicon-based photonics substrate comprising a silicon waveguide structure, depositing a dielectric layer over the planarized silicon-based photonics substrate, selectively etching the dielectric layer, thereby exposing at least a portion of the silicon waveguide structure, selectively etching the exposed portion of the silicon waveguide structure to form a template, using the silicon waveguide structure as a seed layer to selectively grow in the template a germanium layer that extends above the dielectric layer, and planarizing the germanium layer to form a planarized germanium layer, wherein the planarized germanium layer does not extend above the dielectric layer.
Public/Granted literature
- US20120288971A1 Co-Integration of Photonic Devices on a Silicon Photonics Platform Public/Granted day:2012-11-15
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