Invention Grant
US08741707B2 Method and system for fabricating edge termination structures in GaN materials
有权
在GaN材料中制造边缘端接结构的方法和系统
- Patent Title: Method and system for fabricating edge termination structures in GaN materials
- Patent Title (中): 在GaN材料中制造边缘端接结构的方法和系统
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Application No.: US13335383Application Date: 2011-12-22
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Publication No.: US08741707B2Publication Date: 2014-06-03
- Inventor: Donald R. Disney , Isik C. Kizilyalli , Linda Romano , Andrew Edwards , Hui Nie
- Applicant: Donald R. Disney , Isik C. Kizilyalli , Linda Romano , Andrew Edwards , Hui Nie
- Applicant Address: US CA San Jose
- Assignee: Avogy, Inc.
- Current Assignee: Avogy, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L29/18 ; H01L29/872 ; H01L29/06 ; H01L29/20 ; H01L21/04

Abstract:
A method for fabricating an edge termination, which can be used in conjunction with GaN-based materials, includes providing a substrate of a first conductivity type. The substrate has a first surface and a second surface. The method also includes forming a first GaN epitaxial layer of the first conductivity type coupled to the first surface of the substrate and forming a second GaN epitaxial layer of a second conductivity type opposite to the first conductivity type. The second GaN epitaxial layer is coupled to the first GaN epitaxial layer. The substrate, the first GaN epitaxial layer and the second GaN epitaxial layer can be referred to as an epitaxial structure.
Public/Granted literature
- US20130161634A1 METHOD AND SYSTEM FOR FABRICATING EDGE TERMINATION STRUCTURES IN GAN MATERIALS Public/Granted day:2013-06-27
Information query
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