Invention Grant
US08741716B2 Semiconductor device with a gate having a bulbous area and a flattened area underneath the bulbous area and method for manufacturing the same 失效
具有球形区域的球门和在球形区域下方的扁平区域的半导体装置及其制造方法

  • Patent Title: Semiconductor device with a gate having a bulbous area and a flattened area underneath the bulbous area and method for manufacturing the same
  • Patent Title (中): 具有球形区域的球门和在球形区域下方的扁平区域的半导体装置及其制造方法
  • Application No.: US13219983
    Application Date: 2011-08-29
  • Publication No.: US08741716B2
    Publication Date: 2014-06-03
  • Inventor: Sung Gil Chun
  • Applicant: Sung Gil Chun
  • Applicant Address: KR Gyeonggi-do
  • Assignee: Hynix Semiconductor Inc.
  • Current Assignee: Hynix Semiconductor Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: Ladas & Parry LLP
  • Priority: KR10-2009-0015115 20090224
  • Main IPC: H01L21/336
  • IPC: H01L21/336
Semiconductor device with a gate having a bulbous area and a flattened area underneath the bulbous area and method for manufacturing the same
Abstract:
A semiconductor device with a gate having a bulbous area and a flattened area underneath the bulbous area is presented. The semiconductor device includes a semiconductor substrate, an isolation layer, a gate insulation layer, and gates. The semiconductor substrate has recess parts that have first grooves which have bulbous-shaped profiles and second vertically flattened profile grooves which extend downward from the first grooves. The gates are formed in the recess parts in which the gate insulation layer is double layered in the bulbous profile areas and is single layered in the flattened profile areas.
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