Invention Grant
- Patent Title: Method of manufacturing a semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US13713049Application Date: 2012-12-13
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Publication No.: US08741731B2Publication Date: 2014-06-03
- Inventor: Yuji Takebayashi , Hirohisa Yamazaki , Sadayoshi Horii , Hideharu Itatani , Arito Ogawa
- Applicant: Hitachi Kokusai Electric Inc.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2009-179631 20090731; JP2010-146099 20100628
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/31

Abstract:
A high-k capacitor insulating film stable at a higher temperature is formed. There is provided a method of manufacturing a semiconductor device. The method comprises: forming a first amorphous insulating film comprising a first element on a substrate; adding a second element different from the first element to the first amorphous insulating film so as to form a second amorphous insulating film on the substrate; and annealing the second amorphous insulating film at a predetermined annealing temperature so as to form a third insulating film by changing a phase of the second amorphous insulating film. The concentration of the second element added to the first amorphous insulating film is controlled according to the annealing temperature.
Public/Granted literature
- US20130122720A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2013-05-16
Information query
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