A method for processing a glass substrate is disclosed. A glass substrate including a first surface, a second surface, and a side surface between the first surface and the second surface is provided. An opaque conductive layer is formed on the second surface and a part of the side surface close to the second surface. Thereafter, a semiconductor process is performed on the first surface. Thereafter, the opaque conductive layer on the second surface and the part of the side surface close to the second surface is removed. The problem of transporting a transparent glass substrate by some semiconductor tools is solved without increasing tool cost by enabling the sensing and transportation of glass substrates with optical sensor and/or electrical chuck. The fabrication of devices with a glass substrate is also achieved.