Invention Grant
- Patent Title: Replacement gate electrode with multi-thickness conductive metallic nitride layers
- Patent Title (中): 具有多层导电金属氮化物层的替代栅电极
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Application No.: US13606702Application Date: 2012-09-07
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Publication No.: US08741757B2Publication Date: 2014-06-03
- Inventor: Hemanth Jagannathan , Vamsi K. Paruchuri
- Applicant: Hemanth Jagannathan , Vamsi K. Paruchuri
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
Gate electrodes having different work functions can be provided by providing conductive metallic nitride layers having different thicknesses in a replacement gate scheme. Upon removal of disposable gate structures and formation of a gate dielectric layer, at least one incremental thickness conductive metallic nitride layer is added within some gate cavities, while not being added in some other gate cavities. A minimum thickness conductive metallic nitride layer is subsequently added as a contiguous layer. Conductive metallic nitride layers thus formed have different thicknesses across different gate cavities. A gate fill conductive material layer is deposited, and planarization is performed to provide multiple gate electrode having different conductive metallic nitride layer thicknesses. The different thicknesses of the conductive metallic nitride layers can provide different work functions having a range of about 400 mV.
Public/Granted literature
- US20130224939A1 REPLACEMENT GATE ELECTRODE WITH MULTI-THICKNESS CONDUCTIVE METALLIC NITRIDE LAYERS Public/Granted day:2013-08-29
Information query
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