Invention Grant
- Patent Title: Reduced corner leakage in SOI structure and method
- Patent Title (中): SOI结构和方法减少角漏
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Application No.: US13796154Application Date: 2013-03-12
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Publication No.: US08741780B2Publication Date: 2014-06-03
- Inventor: Joseph Ervin , Jeffrey B. Johnson , Paul C. Parries , Chengwen Pei , Geng Wang , Yanli Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Witham, Curtis, Christofferson & Cook, P.C.
- Agent Joseph P. Abate
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461

Abstract:
A structural alternative to retro doping to reduce transistor leakage is provided by providing a liner in a trench, undercutting a conduction channel region in an active semiconductor layer, etching a side, corner and/or bottom of the conduction channel where the undercut exposes semiconductor material in the active layer and replacing the removed portion of the conduction channel with insulator. This shaping of the conduction channel increases the distance to adjacent circuit elements which, if charged, could otherwise induce a voltage and cause a change in back-channel threshold in regions of the conduction channel and narrows and reduces cross-sectional area of the channel where the conduction in the channel is not well-controlled; both of which effects significantly reduce leakage of the transistor.
Public/Granted literature
- US20130189826A1 Reduced Corner Leakage in SOI Structure and Method Public/Granted day:2013-07-25
Information query
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