Invention Grant
- Patent Title: High Tg epoxy systems for composite applications
- Patent Title (中): 用于复合应用的高Tg环氧树脂体系
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Application No.: US12811230Application Date: 2009-01-05
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Publication No.: US08742018B2Publication Date: 2014-06-03
- Inventor: Jeffery L. Reynolds , Rajesh H. Turakhia , George Jacob , Marty J. Null
- Applicant: Jeffery L. Reynolds , Rajesh H. Turakhia , George Jacob , Marty J. Null
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- International Application: PCT/US2009/030096 WO 20090105
- International Announcement: WO2009/089145 WO 20090716
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L63/02 ; C08L63/04

Abstract:
A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
Public/Granted literature
- US20100292415A1 HIGH TG EPOXY SYSTEMS FOR COMPOSITE APPLICATIONS Public/Granted day:2010-11-18
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