Invention Grant
US08742031B2 Solvent-soluble 6,6-polyimide copolymers and processes for preparing them
有权
溶剂可溶性6,6-聚酰亚胺共聚物及其制备方法
- Patent Title: Solvent-soluble 6,6-polyimide copolymers and processes for preparing them
- Patent Title (中): 溶剂可溶性6,6-聚酰亚胺共聚物及其制备方法
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Application No.: US12594523Application Date: 2007-04-03
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Publication No.: US08742031B2Publication Date: 2014-06-03
- Inventor: Hiroshi Itatani
- Applicant: Hiroshi Itatani
- Applicant Address: JP JP
- Assignee: Solpit Industries, Ltd.,Sojitz Corporation
- Current Assignee: Solpit Industries, Ltd.,Sojitz Corporation
- Current Assignee Address: JP JP
- Agency: The Webb Law Firm
- International Application: PCT/JP2007/057471 WO 20070403
- International Announcement: WO2008/120398 WO 20081009
- Main IPC: C08G73/10
- IPC: C08G73/10
Abstract:
Heat-resistant polyimide copolymers having the following four components: pyromellitic dianhydride (PMDA), 1,4-diaminodiphenyl ether (DADE), biphenyltetracarboxylic dianhydride (BPDA), and 2,4-diaminotoluene (DAT) are provided. In an embodiment the molar ratio of (BPDA):(DADE):(PMDA):(DAT) is 2:2:m:m, in which m is an integer of 3, 4 or 5.
Public/Granted literature
- US20130018167A1 Solvent-Soluble 6,6-Polyimide Copolymers and Processes for Preparing Them Public/Granted day:2013-01-17
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