Invention Grant
- Patent Title: Housing assembly to enclose and ground an electrical subassembly
- Patent Title (中): 外壳组件，用于封闭和接地电子组件
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Application No.: US13307950Application Date: 2011-11-30
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Publication No.: US08742255B2Publication Date: 2014-06-03
- Inventor: Slobodan Pavlovic , Nadir Sharaf , Dilip Daftuar , David Menzies
- Applicant: Slobodan Pavlovic , Nadir Sharaf , Dilip Daftuar , David Menzies
- Applicant Address: US MI Southfield
- Assignee: Lear Corporation
- Current Assignee: Lear Corporation
- Current Assignee Address: US MI Southfield
- Agency: Brooks Kushman P.C.
- Main IPC: H02G3/08
- IPC: H02G3/08 ; H05K7/00
Abstract:
A housing assembly to enclose an electrical subassembly includes a housing formed from a conductive polymer. The housing has a cavity sized to receive an electronic sub-assembly therein. A conductive boss is insert-molded into the housing in conductive contact with the housing. A conductive bracket is fastened to the boss in conductive connection with the boss and the housing to support and electrically ground the housing.
Public/Granted literature
- US20130135797A1 HOUSING ASSEMBLY TO ENCLOSE AND GROUND AN ELECTRICAL SUBASSEMBLY Public/Granted day:2013-05-30
Information query
IPC分类:
