Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US13482444Application Date: 2012-05-29
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Publication No.: US08742256B2Publication Date: 2014-06-03
- Inventor: Cheng Qian , Li-Fu Xu , Hui Yu , Xin-Xiang Li , Yue-Yong Li
- Applicant: Cheng Qian , Li-Fu Xu , Hui Yu , Xin-Xiang Li , Yue-Yong Li
- Applicant Address: CN Wuhan TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Wuhan TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110271056 20110914
- Main IPC: H05K5/02
- IPC: H05K5/02

Abstract:
An electronic device enclosure includes a rear panel and a blocking board. The rear panel comprises a front surface and a back surface opposite to the front surface. A through opening is defined in the rear panel. The blocking board comprises a main body, a first flange and a second flange opposite to the first flange. A first stopping piece is extends from the first flange. A second stopping piece is extended from the second flange. A latch portion is located on the first flange. A first protrusion is located on the second flange. The latch portion and the second protrusion extend through the through opening by being elastically deformed, the latch portion and the second protrusion abut on the front surface, and the first stopping piece and the second stopping piece abut on the back surface.
Public/Granted literature
- US20130063005A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2013-03-14
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