Invention Grant
- Patent Title: Circuit board device and circuit board module device
- Patent Title (中): 电路板装置和电路板模块装置
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Application No.: US12446337Application Date: 2007-10-05
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Publication No.: US08742260B2Publication Date: 2014-06-03
- Inventor: Junya Sato
- Applicant: Junya Sato
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-284061 20061018
- International Application: PCT/JP2007/069546 WO 20071005
- International Announcement: WO2008/047619 WO 20080424
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
Provided is a circuit board device in which printed wiring boards 11, 12 are connected to each other electrically using a anisotropic conductive member 15 disposed between the printed wiring boards 11, 12. The anisotropic conductive member 15 comprises: an insulating elastic resin material 16; fine metal wires 17 having a middle portion embedded within the insulating elastic resin material 16 so as to connect corresponding connecting terminals of the printed wiring boards 11, 12; and resin layers 18 exhibiting a flexural rigidity greater than that of the insulating elastic resin material. An assembly composed of the printed wiring boards 11, 12 and anisotropic conductive member 15 is curved. The resin layers are shape-retaining resins for maintaining the curvature of respective ones of principal surfaces of the anisotropic conductive member 15 made to conform to curvature of the printed wiring boards 11, 12.
Public/Granted literature
- US20100315789A1 CIRCUIT BOARD DEVICE AND CIRCUIT BOARD MODULE DEVICE Public/Granted day:2010-12-16
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