Invention Grant
- Patent Title: Heating apparatus and method for making the same
- Patent Title (中): 加热装置及其制造方法
-
Application No.: US13461803Application Date: 2012-05-02
-
Publication No.: US08742303B2Publication Date: 2014-06-03
- Inventor: Wing Yiu Yeung , Keith Mario Torpy
- Applicant: Wing Yiu Yeung , Keith Mario Torpy
- Applicant Address: HK Hong Kong
- Assignee: Advanced Materials Enterprises Company Limited
- Current Assignee: Advanced Materials Enterprises Company Limited
- Current Assignee Address: HK Hong Kong
- Main IPC: H05B1/02
- IPC: H05B1/02 ; H05B3/22 ; H05B3/26
Abstract:
A heating apparatus includes a heating element adapted to be disposed on a substrate. The heating element includes electrodes and a multi-layer conductive coating of nano-thickness disposed between the substrate and electrodes. The multi-layer conductive coating has a structure and composition which stabilize performance of the heating element at high temperatures. The multi-layer conductive coating may be produced by spray pyrolysis.
Public/Granted literature
- US20130140294A1 HEATING APPARATUS AND METHOD FOR MAKING THE SAME Public/Granted day:2013-06-06
Information query
