Invention Grant
US08742372B2 Separation of doping density and minority carrier lifetime in photoluminescence measurements on semiconductor materials 有权
在半导体材料的光致发光测量中分离掺杂密度和少数载流子寿命

  • Patent Title: Separation of doping density and minority carrier lifetime in photoluminescence measurements on semiconductor materials
  • Patent Title (中): 在半导体材料的光致发光测量中分离掺杂密度和少数载流子寿命
  • Application No.: US13384970
    Application Date: 2010-07-19
  • Publication No.: US08742372B2
    Publication Date: 2014-06-03
  • Inventor: Thorsten Trupke
  • Applicant: Thorsten Trupke
  • Applicant Address: AU Redfern
  • Assignee: BT Imaging Pty Ltd
  • Current Assignee: BT Imaging Pty Ltd
  • Current Assignee Address: AU Redfern
  • Agency: Mattingly & Malur, PC
  • Priority: AU2009903369 20090720
  • International Application: PCT/AU2010/000908 WO 20100719
  • International Announcement: WO2011/009159 WO 20110127
  • Main IPC: G01N21/64
  • IPC: G01N21/64
Separation of doping density and minority carrier lifetime in photoluminescence measurements on semiconductor materials
Abstract:
Methods are presented for separating the effects of background doping density and effective minority carrier lifetime on photoluminescence (PL) generated from semiconductor materials. In one embodiment the background doping density is measured by another technique, enabling PL measurements to be analyzed in terms of effective minority carrier lifetime. In another embodiment the effective lifetime is measured by another technique, enabling PL measurements to be analyzed in terms of background doping density. In yet another embodiment, the effect of background doping density is removed by calculating intensity ratios of two PL measurements obtained in different spectral regions, or generated by different excitation wavelengths. The methods are particularly useful for bulk samples such as bricks or ingots of silicon, where information can be obtained over a much wider range of bulk lifetime values than is possible with thin, surface-limited samples such as silicon wafers. The methods may find application in solar cell manufacturing for improving the manufacture of silicon ingots and bricks, or for providing a cutting guide for wafering.
Information query
Patent Agency Ranking
0/0