Invention Grant
US08742376B2 Method and apparatus of mask drawing using a grounding body at lowest resistance value position of the mask
失效
在掩模的最低电阻值位置使用接地体进行掩模绘制的方法和装置
- Patent Title: Method and apparatus of mask drawing using a grounding body at lowest resistance value position of the mask
- Patent Title (中): 在掩模的最低电阻值位置使用接地体进行掩模绘制的方法和装置
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Application No.: US13904434Application Date: 2013-05-29
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Publication No.: US08742376B2Publication Date: 2014-06-03
- Inventor: Takayuki Ohnishi
- Applicant: NuFlare Technology, Inc.
- Applicant Address: JP Numazu-shi
- Assignee: NuFlare Technology, Inc.
- Current Assignee: NuFlare Technology, Inc.
- Current Assignee Address: JP Numazu-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-148275 20120702
- Main IPC: H01L21/027
- IPC: H01L21/027 ; G03F7/20 ; H01J37/317 ; G03F1/40
Abstract:
A mask drawing method includes: disposing a grounding body provided with a grounding pin at a plurality of different places on a mask substrate to measure resistance values; disposing the grounding body at a position where the resistance value is lowest, among the plural positions where the resistance values are measured; and irradiating an electron beam to the mask substrate to draw a desired pattern.
Public/Granted literature
- US20140001380A1 MASK DRAWING METHOD, MASK DRAWING APPARATUS Public/Granted day:2014-01-02
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