Variable resistance memory devices may include a semiconductor layer including first, second, third doped regions, a variable resistance pattern on the semiconductor layer, a lower electrode between the semiconductor layer and the variable resistance pattern, and a first metal silicide pattern in contact with the semiconductor layer. The third doped region may be spaced apart from the first metal silicide pattern, the first doped region may be spaced apart from the third doped region, and a second doped region may be interposed between the first and third doped regions and be in contact with the first metal silicide pattern. The first doped region may have the same conductivity type as the third doped region and a different conductivity type from the second doped region.