Invention Grant
- Patent Title: Pixel structure and manufacturing method thereof
- Patent Title (中): 像素结构及其制造方法
-
Application No.: US13954999Application Date: 2013-07-31
-
Publication No.: US08742437B2Publication Date: 2014-06-03
- Inventor: Tsung-Chin Cheng , Zeng-De Chen , Seok-Lyul Lee
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99120280A 20100622
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A pixel structure including a substrate, a color filter layer, a conductive light-shielding layer, a buffer layer, a scan line, a data line, an active device, and a pixel electrode is provided. The substrate has a pixel region. The color filter layer is disposed corresponding to the pixel region. The conductive light-shielding layer is disposed corresponding to the periphery of the pixel region. The buffer layer covers the conductive light-shielding layer and color filter layer. The scan line and the data line are disposed on the buffer layer. The active device is disposed on the buffer layer and electrically connected to the scan line and data line. The pixel electrode is disposed on the buffer layer and electrically connected to the active device, wherein an overlapping area between the pixel electrode and the conductive light-shielding layer constitutes a storage capacitor. A method for manufacturing the pixel structure is also provided.
Public/Granted literature
- US20130313600A1 PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-11-28
Information query
IPC分类: