Invention Grant
- Patent Title: Light emitting diode epitaxial structure and manufacturing method of the same
- Patent Title (中): 发光二极管外延结构及其制造方法相同
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Application No.: US13517554Application Date: 2012-06-13
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Publication No.: US08742443B2Publication Date: 2014-06-03
- Inventor: Ya-Wen Lin , Shih-Cheng Huang , Po-Min Tu
- Applicant: Ya-Wen Lin , Shih-Cheng Huang , Po-Min Tu
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110354599 20111110
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/22 ; H01L33/20

Abstract:
An LED epitaxial structure includes a substrate, a buffer layer, a functional layer and a light generating layer. The buffer layer is located on a top surface of the substrate. The functional layer includes a plurality of high-temperature epitaxial layers and low-temperature epitaxial layers alternatively arranged between the buffer layer and light generating layer. A textured structure is formed in the low-temperature epitaxial layer. A SiO2 layer including a plurality of convexes is located on the textured structure to increase light extraction efficiency of the LED epitaxial structure. A manufacturing method of the LED epitaxial structure is also disclosed.
Public/Granted literature
- US20130119421A1 LIGHT EMITTING DIODE EPITAXIAL STRUCTURE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2013-05-16
Information query
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