Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13738292Application Date: 2013-01-10
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Publication No.: US08742454B2Publication Date: 2014-06-03
- Inventor: Shinya Iwasaki
- Applicant: Shinya Iwasaki
- Applicant Address: JP Toyota
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota
- Agency: Oliff PLC
- Priority: JP2012-006487 20120116
- Main IPC: H01L27/06
- IPC: H01L27/06

Abstract:
In a semiconductor device having a semiconductor substrate on which a diode and an IGBT are formed, a cathode region of the diode and a collector region of the IGBT are formed in a range exposed to one surface of the semiconductor substrate. On the surface, a first conductor layer that is in contact with the cathode region, and a second conductor layer that is in contact with the collector region are formed. The work function of the second conductor layer is larger than the work function of the first conductor layer.
Public/Granted literature
- US20130181254A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-07-18
Information query
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