Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13273544Application Date: 2011-10-14
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Publication No.: US08742500B2Publication Date: 2014-06-03
- Inventor: Yasuhiko Onishi
- Applicant: Yasuhiko Onishi
- Applicant Address: JP
- Assignee: Fuji Electric Co., Ltd
- Current Assignee: Fuji Electric Co., Ltd
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2010-236394 20101021
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device is disclosed wherein a peripheral region with a high breakdown voltage and high robustness against induced surface charge is manufactured using a process with high mass productivity. The device has n-type drift region and p-type partition region of layer-shape deposited in a vertical direction to one main surface of n-type semiconductor substrate with high impurity concentration form as drift layer, alternately adjacent parallel pn layers in a direction along one main surface. Active region through which current flows and peripheral region enclosing the active region include parallel pn layers. P-type partition region has impurity concentration distribution where concentration decreases from surface toward substrate side, n-type surface region disposed on parallel pn layers in peripheral region, p-type guard rings disposed separately from each other on n-type surface region, and field plate disposed on inner and outer circumferential sides of p-type guard rings, and electrically connected.
Public/Granted literature
- US20120098064A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-04-26
Information query
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