Invention Grant
- Patent Title: Semiconductor device having lateral diode
- Patent Title (中): 具有侧向二极管的半导体器件
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Application No.: US13197719Application Date: 2011-08-03
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Publication No.: US08742534B2Publication Date: 2014-06-03
- Inventor: Takao Yamamoto , Norihito Tokura , Hisato Kato , Akio Nakagawa
- Applicant: Takao Yamamoto , Norihito Tokura , Hisato Kato , Akio Nakagawa
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2010-175464 20100804; JP2011-118863 20110527
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/47

Abstract:
A semiconductor device having a lateral diode includes a semiconductor layer, a first semiconductor region in the semiconductor layer, a contact region having an impurity concentration greater than that of the first semiconductor region, a second semiconductor region located in the semiconductor layer and separated from the contact region, a first electrode electrically connected through the contact region to the first semiconductor region, and a second electrode electrically connected to the second semiconductor region. The second semiconductor region includes a low impurity concentration portion, a high impurity concentration portion, and an extension portion. The second electrode forms an ohmic contact with the high impurity concentration portion. The extension portion has an impurity concentration greater than that of the low impurity concentration portion and extends in a thickness direction of the semiconductor layer.
Public/Granted literature
- US20120032313A1 SEMICONDUCTOR DEVICE HAVING LATERAL DIODE Public/Granted day:2012-02-09
Information query
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