Invention Grant
- Patent Title: SiGe HBT and manufacturing method thereof
- Patent Title (中): SiGe HBT及其制造方法
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Application No.: US13671595Application Date: 2012-11-08
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Publication No.: US08742538B2Publication Date: 2014-06-03
- Inventor: Wensheng Qian
- Applicant: Shanghai Hua Hong NEC Electronics Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.
- Current Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: MKG, LLC
- Priority: CN201110349921 20111108
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L29/66

Abstract:
A silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) is disclosed, which includes: two isolation structures each being formed in a trench; a set of three or more pseudo buried layers formed under each trench with every adjacent two pseudo buried layers of the set being vertically contacted with each other; and a collector region. In this design, the lowermost pseudo buried layers of the two sets are laterally in contact with each other, and the collector region is surrounded by the two isolation structures and the two sets of pseudo buried layers. As the breakdown voltage of a SiGe HBT according to the present invention is determined by the distance between an uppermost pseudo buried layer and the edge of an active region, SiGe HBTs having different breakdown voltages can be achieved. A manufacturing method of the SiGe HBT is also disclosed.
Public/Granted literature
- US20130113022A1 SIGE HBT AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-05-09
Information query
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