Invention Grant
US08742539B2 Semiconductor component and method for producing a semiconductor component
有权
半导体元件的制造方法及半导体元件的制造方法
- Patent Title: Semiconductor component and method for producing a semiconductor component
- Patent Title (中): 半导体元件的制造方法及半导体元件的制造方法
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Application No.: US13560626Application Date: 2012-07-27
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Publication No.: US08742539B2Publication Date: 2014-06-03
- Inventor: Joachim Weyers , Kevni Bueyuektas , Franz Hirler , Anton Mauder
- Applicant: Joachim Weyers , Kevni Bueyuektas , Franz Hirler , Anton Mauder
- Applicant Address: AU Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AU Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/86
- IPC: H01L29/86
Abstract:
One aspect of the invention relates to a semiconductor component with a semiconductor body with a top side and with a bottom side. A first coil that is monolithically integrated with the semiconductor body is arranged distant from the bottom side and comprises N first windings, wherein N≧1. The first coil has a first coil axis that extends in a direction different from a surface normal of the bottom side.
Public/Granted literature
- US20140027879A1 SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT Public/Granted day:2014-01-30
Information query
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