Invention Grant
- Patent Title: Substrate strip plate structure for semiconductor device and method of manufacturing the same
- Patent Title (中): 用于半导体器件的基板带状板结构及其制造方法
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Application No.: US13264063Application Date: 2010-04-14
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Publication No.: US08742545B2Publication Date: 2014-06-03
- Inventor: Huilong Zhu , Haizhou Yin , Zhijiong Luo
- Applicant: Huilong Zhu , Haizhou Yin , Zhijiong Luo
- Applicant Address: CN Suzhou
- Assignee: Sunovel Suzhou Technologies Ltd.
- Current Assignee: Sunovel Suzhou Technologies Ltd.
- Current Assignee Address: CN Suzhou
- Agency: Troutman Sanders LLP
- Priority: CN201010120365 20100305
- International Application: PCT/CN2010/071770 WO 20100414
- International Announcement: WO2010/118687 WO 20101021
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/308
Abstract:
A strip plate structure and a method of manufacturing the same are disclosed. In one embodiment, the strip plate structure comprises a strip plate array comprising a plurality of strip plates arranged in a predetermined direction with spacing. Each of the strip plates includes a first surface facing one side direction of the strip plate structure and a second surface facing an substantially opposite side direction of the strip plate structure; and a plurality of strip sheets. Each strip sheet alternately abuts either the first surfaces or the second surfaces of two adjacent strip plates.
Public/Granted literature
- US20120181664A1 SUBSTRATE STRUCTURE FOR SEMICONDUCTOR DEVICE FABRICATION AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-07-19
Information query
IPC分类:
