Invention Grant
- Patent Title: Semiconductor package and method of manufacturing the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13716652Application Date: 2012-12-17
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Publication No.: US08742551B2Publication Date: 2014-06-03
- Inventor: Min Suh Park
- Applicant: STS Semiconductor & Telecommunications Co., Ltd.
- Applicant Address: KR Chungcheongnam-do
- Assignee: STS Semiconductor & Telecommunications Co., Ltd
- Current Assignee: STS Semiconductor & Telecommunications Co., Ltd
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: KR10-2012-0043894 20120426
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A semiconductor package including: a lead frame including a chip attachment unit and a lead unit; a semiconductor chip that is mounted on the chip attachment unit of the lead frame; a wire that electrically connects the semiconductor chip to the lead unit; an insulation layer formed in the lead frame under the chip attachment unit; and an encapsulant that seals an upper portion of the lead frame, the semiconductor chip, and the wire, wherein the lead unit does not protrude to the outside of the encapsulant.
Public/Granted literature
- US20130285222A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-10-31
Information query
IPC分类:
