Invention Grant
- Patent Title: Semiconductor module
- Patent Title (中): 半导体模块
-
Application No.: US13349993Application Date: 2012-01-13
-
Publication No.: US08742556B2Publication Date: 2014-06-03
- Inventor: Takuya Kadoguchi , Tomomi Okumura , Tatsuya Miyoshi
- Applicant: Takuya Kadoguchi , Tomomi Okumura , Tatsuya Miyoshi
- Applicant Address: JP Toyota-Shi
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-Shi
- Agency: Kenyon & Kenyon LLP
- Priority: JP2011-005961 20110114
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A semiconductor module comprises: a metal block; a semiconductor device installed via a solder layer in a semiconductor device installation area on a surface of the metal block; and a molded portion formed by molding a resin on the metal block and the semiconductor device; wherein the surface of the metal block includes a plating area and a roughened area, and the semiconductor device installation area is provided in the plating area.
Public/Granted literature
- US20120181679A1 SEMICONDUCTOR MODULE Public/Granted day:2012-07-19
Information query
IPC分类:
