Invention Grant
- Patent Title: Chip package and method for forming the same
- Patent Title (中): 芯片封装及其形成方法
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Application No.: US13350520Application Date: 2012-01-13
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Publication No.: US08742564B2Publication Date: 2014-06-03
- Inventor: Bai-Yao Lou , Tsang-Yu Liu , Chia-Sheng Lin , Tzu-Hsiang Hung
- Applicant: Bai-Yao Lou , Tsang-Yu Liu , Chia-Sheng Lin , Tzu-Hsiang Hung
- Agency: Liu & Liu
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
An embodiment of the invention provides a chip package which includes a substrate having a first surface and a second surface; a conducting pad structure located on the first surface; a dielectric layer located on the first surface of the substrate and the conducting pad structure, wherein the dielectric layer has an opening exposing a portion of the conducting pad structure; and a cap layer located on the dielectric layer and filled into the opening.
Public/Granted literature
- US20120181672A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2012-07-19
Information query
IPC分类:
