Invention Grant
- Patent Title: Circuit board structure and packaging structure comprising the circuit board structure
- Patent Title (中): 电路板结构和包装结构包括电路板结构
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Application No.: US13531608Application Date: 2012-06-25
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Publication No.: US08742567B2Publication Date: 2014-06-03
- Inventor: Lee-Sheng Yen
- Applicant: Lee-Sheng Yen
- Applicant Address: TW Luchu, Taoyuan
- Assignee: Advance Materials Corporation
- Current Assignee: Advance Materials Corporation
- Current Assignee Address: TW Luchu, Taoyuan
- Agent Winston Hsu; Scott Margo
- Priority: TW099113040A 20100426
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A circuit board structure at least includes a patterned solder mask, a first conductive pattern, a second conductive pattern adjacent to the first conductive pattern and in direct contact with the patterned solder mask and a passivation respectively covering the first conductive pattern and the second conductive pattern.
Public/Granted literature
- US20120261176A1 CIRCUIT BOARD STRUCTURE AND PACKAGING STRUCTURE COMPRISING THE CIRCUIT BOARD STRUCTURE Public/Granted day:2012-10-18
Information query
IPC分类:
