Invention Grant
US08742585B2 Semiconductor device having a plurality of pads of low diffusible material formed in a substrate
有权
半导体器件具有形成在衬底中的多个可扩散材料的焊盘
- Patent Title: Semiconductor device having a plurality of pads of low diffusible material formed in a substrate
- Patent Title (中): 半导体器件具有形成在衬底中的多个可扩散材料的焊盘
-
Application No.: US13758775Application Date: 2013-02-04
-
Publication No.: US08742585B2Publication Date: 2014-06-03
- Inventor: Atsushi Okuyama
- Applicant: Sony Corporation
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2009-193324 20090824
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/768
Abstract:
A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.
Public/Granted literature
- US20130140699A1 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE Public/Granted day:2013-06-06
Information query
IPC分类:
