Invention Grant
US08742700B1 Accelerator having acceleration channels formed between covalently bonded chips 有权
具有在共价键合芯片之间形成加速通道的加速器

  • Patent Title: Accelerator having acceleration channels formed between covalently bonded chips
  • Patent Title (中): 具有在共价键合芯片之间形成加速通道的加速器
  • Application No.: US13952569
    Application Date: 2013-07-26
  • Publication No.: US08742700B1
    Publication Date: 2014-06-03
  • Inventor: Kim L. HaileyRobert O. Conn
  • Applicant: Transmute, Inc.
  • Applicant Address: US CA Los Gatos
  • Assignee: Transmute, Inc.
  • Current Assignee: Transmute, Inc.
  • Current Assignee Address: US CA Los Gatos
  • Agency: Imperium Patent Works
  • Agent T. Lester Wallace; Darien K. Wallace
  • Main IPC: H05H7/00
  • IPC: H05H7/00
Accelerator having acceleration channels formed between covalently bonded chips
Abstract:
An accelerator assembly includes a first chip and a second chip. An acceleration channel is formed into a surface of a first side of the first chip. The first side of the first chip is covalently bonded to a first side of the second chip such that the channel is a tubular void between the first and second chips. The channel has a tubular inside sidewall surface, substantially no portion of which is a metal surface. The channel has length-to-width ratio greater than five, and a channel width less than one micron. There are many substantially identical channels that extend in parallel between the first and second chips. In one specific example, the assembly is part of a Direct Write On Wafer (DWOW) printing system. The DWOW printing system is useful in semiconductor processing in that it can direct write an image onto a 300 mm diameter wafer in one minute.
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