Invention Grant
- Patent Title: Sensor probe and methods of assembling same
- Patent Title (中): 传感器探头及其组装方法
-
Application No.: US13010026Application Date: 2011-01-20
-
Publication No.: US08742769B2Publication Date: 2014-06-03
- Inventor: Boris Leonid Sheikman , Yongjae Lee
- Applicant: Boris Leonid Sheikman , Yongjae Lee
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Fletcher Yoder P.C.
- Main IPC: G01R27/32
- IPC: G01R27/32

Abstract:
A method of assembling a sensor probe for use in a sensor assembly is provided. The method includes providing an emitter configured to generate at least one forward propagating electromagnetic field from at least one microwave signal and to generate at least one backward propagating electromagnetic field. A data conduit is coupled to the emitter. Moreover, a ground conductor is extended substantially circumferentially about the data conduit. The ground conductor is configured to substantially reduce electromagnetic radiation within the sensor assembly.
Public/Granted literature
- US20120187960A1 SENSOR PROBE AND METHODS OF ASSEMBLING SAME Public/Granted day:2012-07-26
Information query