Invention Grant
- Patent Title: Apparatus for measuring a radius of a workpiece
- Patent Title (中): 用于测量工件半径的装置
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Application No.: US13236190Application Date: 2011-09-19
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Publication No.: US08742774B2Publication Date: 2014-06-03
- Inventor: Joseph D. Drescher
- Applicant: Joseph D. Drescher
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: O'Shea Getz P.C.
- Main IPC: G01R27/26
- IPC: G01R27/26

Abstract:
An apparatus for measuring a workpiece includes a capacitance probe mounted to a probe housing and a non-conductive spacer. The capacitance probe includes a probe tip with a sensor surface that emits an electric field. The non-conductive spacer extends between a probe contact surface and a workpiece contact surface. The probe contact surface covers the sensor surface, and the workpiece contact surface contacts the workpiece during the measuring of the radius.
Public/Granted literature
- US20130069674A1 APPARATUS FOR MEASURING A RADIUS OF A WORKPIECE Public/Granted day:2013-03-21
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