Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
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Application No.: US13551353Application Date: 2012-07-17
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Publication No.: US08742793B2Publication Date: 2014-06-03
- Inventor: Hiromi Ogata
- Applicant: Hiromi Ogata
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2007-289250 20071107
- Main IPC: H03K19/00
- IPC: H03K19/00

Abstract:
A semiconductor integrated circuit includes: a main-interconnect to which supply voltage or reference voltage is applied; a plurality of sub-interconnects; a plurality of circuit cells configured to be connected to the plurality of sub-interconnects; a power supply switch cell configured to control, in accordance with an input control signal, connection and disconnection between the main-interconnect and the sub-interconnect to which a predetermined one of the circuit cells is connected, of the plurality of sub-interconnects; and an auxiliary interconnect configured to connect the plurality of sub-interconnects to each other.
Public/Granted literature
- US20130049073A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2013-02-28
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