Invention Grant
- Patent Title: MEMS element, and manufacturing method of MEMS element
- Patent Title (中): MEMS元件和MEMS元件的制造方法
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Application No.: US13322990Application Date: 2011-02-24
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Publication No.: US08742872B2Publication Date: 2014-06-03
- Inventor: Tomohiro Iwasaki , Keiji Onishi , Kunihiko Nakamura
- Applicant: Tomohiro Iwasaki , Keiji Onishi , Kunihiko Nakamura
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-062187 20100318
- International Application: PCT/JP2011/001051 WO 20110224
- International Announcement: WO2011/114628 WO 20110922
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/10 ; H03B5/30 ; H03H3/007 ; H01L21/62 ; H01L23/02 ; H03H9/24 ; B81B3/00 ; B81B7/00 ; B81C1/00

Abstract:
In a MEMS device having a substrate 1, a sealing membrane 7, and a movable portion 3 of beam and an electrode 5 which have a region wherein they overlap with a gap in perpendicular to a substrate 1 surface, a first cavity 9 is on the side of the movable portion 3 in the direction perpendicular to the surface of the substrate, and a second cavity is the other cavity, and an inner surface a of a side wall A in contact with the electrode 5, of the first cavity 9, is positioned more inside than an inner surface b of a side wall B in contact with the electrode 5, of the second cavity 10, in the direction parallel to the substrate surface, such that the movable portion 3 does not collide with the electrode 5 when mechanical stress is applied from outside to the sealing membrane 7.
Public/Granted literature
- US20120075030A1 MEMS ELEMENT, AND MANUFACTURING METHOD OF MEMS ELEMENT Public/Granted day:2012-03-29
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